8(e). Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

8(e). 高熔点焊料中的铅（即，含铅量大于等于85%的铅基合金）

备注

(2) 该豁免应于2024年复审。

8(f)(b). Lead in compliant pin connector systems other than the mating area of vehicle harness connectors

8(f)(b). 除车辆线束连接器连接区外的顺应针连接系统中的铅

Vehicles type-approved before 1 January 2024 and spare parts for these vehicles

2024年1月1日前批准的汽车类别及该类汽车的零配件

X

8(g)(i). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

8(g)(i). 用于完成集成电路倒装芯片封装中的半导体芯片和载体之间可行电连接的焊料中的铅

Vehicles type-approved before 1 October 2022 and spare parts for these Vehicles

2020年1月1日前批准的汽车类别及该类汽车的零配件

8(g)(ii). Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following:

(i)   a semiconductor technology node of 90 nm or larger;

(ii)    a single die of 300 mm2 or larger in any semiconductor technology node;

(iii)    stacked die packages with dies of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.

8(g)(ii). 用于完成集成电路倒装芯片封装中的半导体芯片和载体之间可行电连接的焊料中的铅，其中该电连接包括以下任意一项：

(i)    大于等于90 nm的半导体技术节点；

(ii)    在任何半导体技术节点中的大于等于300 mm2的单个芯片；

(iii)    含大于等于300 mm2的芯片的堆叠芯片封装或大于等于300 mm2的硅中介层。

(2)

2020年1月1日前批准的汽车类别及该类汽车的零配件

X

备注：

(2) 该豁免应于2024年复审。

8(k). Soldering of heating applications with 0,5A or more of heat current per related solder joint to single panes of laminated glazings not exceeding wall thickness of 2,1 mm. This exemption does not cover soldering to contacts embedded in the intermediate polymer.

8(k). 焊接在电流大于等于0.5A的加热设备中的壁厚不超过2.1mm的层压玻璃单层中的每个相关焊点。此豁免不包括焊接到嵌入中间聚合物中的触点。